Integrated chip

The concept of integrated chip originated from the "advanced packaging" concept proposed by Dr. Shangyi Chiang of TSMC in 2010, who proposed that two chips can be connected through semiconductor interconnection technology, thereby solving the upper limit of the area of single chip manufacturing and solving the bandwidth limit of board-level connection. Later, Dr. Sehat Sutrardja, then president of Marvell Electronics, further integrated the "modular" design idea and method. After development, "advanced packaging" can no longer cover the science and technology of the new system formed after the integration of multi-core particles, so at the Double Clear Forum held by the Natural Science Foundation in 2022, Academician Sun Ninghui, Academician Liu Ming and Mr. Jiang Shangyi and other Chinese scholars put forward the concept of "Integrated Chips" to replace the terms "advanced packaging" and "core" after summarizing the relevant basic technologies, and to express its richer meaning in the fields of architecture, design methodology, mathematical basic theory, engineering material manufacturing and so on.